Processing
Tria Technologies Unveils COM-HPC Computer-on-Module Powered by Intel Core Ultra Processors with 180 TOPS AI Performance
April 17, 2026
Tria Technologies launched the COM-HPC Client Computer-on-Module (CoM) leveraging the Intel Core Ultra Processors (Series 3). The module features an integrated AI accelerator (NPU) as well as Intel Xe graphics with up to 12 Xe cores, promoting up to 180 trillion operations per second (TOPS).
Security
Digi DAL OS Solutions Gain FIPS 140-3 Validation for Government and Regulated Industries
April 16, 2026
Digi International publicized an advancement in device security with the validation of FIPS 140-3 cryptographic modules across its portfolio of solutions based on the Digi Accelerated Linux (DAL) operating system including Digi EX, IX and TX Cellular Routers, Digi Connect IT Console Servers, Digi Connect EZ Serial Device and Terminal Servers, and Digi AnywhereUSB USB Over IP. According to the press release, Digi is the first provider of cellular connectivity solutions to achieve FIPS 140-3 validation without specialized SKUs.
Multimedia
ICYMI Ep 58: Siemens, eInfochips, MicroelectronicsUS
April 17, 2026
Hello Embedded Professionals, Engineers, and Developers! Welcome to In Case You Missed it, the weekly news show all about Embedded technologies and solutions from Embedded Computing Design.
AI & Machine Learning
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Embedded AI Isn’t Enterprise AI, and That’s a Good Thing
April 13, 2026
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Scale-Up & Scale Out: Addressing the Demands of Modern AI Networks
April 09, 2026
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embedded world 2026 Podcast with Axelera AI
March 25, 2026
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Kontron KBox A‑151 EAI Now Powered by SiMa.ai Physical AI for Industrial Edge
March 20, 2026
Automotive
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eSOL and Quintauris Partner to Expand Software Integration in RISC-V Automotive Platforms
March 23, 2026
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How BASE-AU Enables High-Speed Optical Camera Links in Next-Generation Vehicles
March 05, 2026
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From Design to Verification: Best Practices for Automotive Functional Safety Certification
February 05, 2026
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Auto Audio Gets Upgrade with Cadence Tensilica
February 05, 2026
IoT
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From COM Express to COM-HPC: Why High-Performance Embedded Systems Must Evolve
April 14, 2026
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Nanomade Debuts Ultra-Sensitive Sensors
April 10, 2026
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MSI IPC to Demo Smart Retail, Machine Vision, and Edge AI at Japan IT Week Spring 2026
April 03, 2026
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Edge AI Solutions, The Memory Crisis, and Sustainable AI
April 02, 2026
Storage
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embedded world 2026 Podcast with Rambus
March 27, 2026
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Accelerate AI Workloads with Rambus HBM4E Memory Controller
March 05, 2026
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Greenliant to Demo High-Endurance Industrial SSD Portfolio at embedded world Germany 2026
March 03, 2026
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The Road to embedded world: Weebit ReRAM Powers Live Edge AI Silicon Demos
February 24, 2026
Processing
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embedded world 2026 Podcast with onsemi
April 16, 2026
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Rapidus Unveils Analysis Center and its Rapidus Chiplet Solutions Hub for Next-Gen Semiconductor Manufacturing
April 14, 2026
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embedded world 2026 Podcast with SCI Semiconductor
April 10, 2026
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Codasip Shifts Focus to Cyber-Resilient SoCs, Divests Low-End RISC-V Business
April 09, 2026
Software & OS
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Aptiv Highlights VxWorks Role in Artemis II Safe Astronaut Return
April 13, 2026
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Collabora Launches Apertis v2026 Based on Debian 13 (Trixie)
April 07, 2026
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embedded world 2026 Podcast with QNX
April 02, 2026
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Renesas Press Conference at embedded world 2026
March 31, 2026
HPC/Datacenters
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PSM Integration for Enhanced Module Solutions in 48 V Data Centers
March 04, 2026
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BCM Teams Up with Intel for 2U Rackmount Edge AI Workstation
March 04, 2026
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Menlo Micro and Purdue University Announces Commercial-Ready Architecture for Scalable Quantum Computing at Cryogenic Temperatures
March 03, 2026
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Accenture to Purchase 65% of DLB, Boosting AI Data Center Engineering and Consulting
December 17, 2025
Edge AI
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Why In-Domain ASR Is the Missing Link for Real Edge AI Deployment
April 10, 2026
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IBASE MBB1002 Delivers AI Acceleration with AMD EPYC Embedded 8004 and PCIe Gen5
April 09, 2026
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embedded world 2026 Podcast with fidus
April 08, 2026