Technology - Processing - Page 40

AI-Blox Blox

Embedded Computing Design Staff

June 16, 2022

Processing

Codasip Customisable Codasip L31

Embedded Computing Design Staff

June 16, 2022

GigaDevice Semiconductor GD32F470 Series of High-Performance MCUs

Embedded Computing Design Staff

June 16, 2022

Menta SAS eFPGA SOFT IP

Embedded Computing Design Staff

June 16, 2022

Connect Tech Forge Carrier for NVIDIA® Jetson AGX Orin

Embedded Computing Design Staff

June 16, 2022

BeagleBoard.org Foundation BeagleBone AI-64

Embedded Computing Design Staff

June 16, 2022

Micro Crystal RV-3032-C7

Embedded Computing Design Staff

June 16, 2022

Semtech LoRa Edge™ LR1120

Embedded Computing Design Staff

June 16, 2022

onsemi RSL15 Bluetooth 5.2 Secure Wireless MCU

Embedded Computing Design Staff

June 16, 2022

NXP Debuts New MCX Portfolio of Microcontrollers for the Next Era of Advanced Industrial and IoT Edge Computing

Tiera Oliver

June 16, 2022

NXP’s MCX Family Addresses All IoT End-Device Development

Rich Nass

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Imagimob Announces tinyML for Sound Event Detection Applications on Synaptics AI Chip

Tiera Oliver

June 14, 2022

AIoT Open Platform for Flexible and Scalable Development

Saumitra Jagdale

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Transforming Edge AI with Clusters of Neural Processing Units

Saumitra Jagdale

June 13, 2022

IAR Systems Accelerates Innovation for Solutions Based on Arm Cortex-M85 Processor

IAR Systems

June 13, 2022

Microchip Announces First RISC-V-Based System-on-Chip FPGA Enters Mass Production

Tiera Oliver

June 13, 2022

Agile Analog Receives Its First Chinese Licensee for Its Analog IP

Chad Cox

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The Problem with the CHIPS Act, Part 2

Embedded Insiders

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Embedded Executive: Jeffrey Morroni, Dir. of Power Management R&D for Kilby Labs, Texas Instruments

Rich Nass

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Synaptics’ FlexSense Sensor Fusion Processor Cuts Board Space and Power

Rich Nass

June 7, 2022

New Module From Grid Connect and RTA Gives Equipment Makers a ‘Universal Translator’ for Industrial Communications

Tiera Oliver

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Product of the Week: WOLF Advanced Technology’s NVIDIA Orin-based 3U VPX SBC

Embedded Computing Design Staff

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u-blox Releases Platform to Test and Validate IoT Solutions

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Codasip Adopts Siemens’ OneSpin Tools for Formal Verification

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Lattice Introduces Next-Gen Control FPGAs and New Solution Stack for ORAN Deployment

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Synopsys Launches the Era of Smarter SoC Design with ML-Driven Big Data Analytics Technology

Tiera Oliver

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Modular Touch Computer Design Helps Create The Most Flexible Gas Monitoring System

DFI Inc.

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Imagination Launches Open Access Program, Providing Scale-Ups with a Low-Cost Path to Differentiated Silicon

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May 31, 2022

i.MX 8M Plus Processor from NXP on COM Form Factor efus from F&S Elektronik Systeme

F&S Elektronik Systeme GmbH

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First In-House Designed Core from Ampere, the AmpereOne

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Analog & Power

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EMASS and Semtech to Showcase Collaboration at CES 2026
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Embedded Executive: The CSA Ushers in ZigBee 4.0 | CSA
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Iternal Offers Intel-Powered AirgapAI Chat for Edge UI
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Secure Boot and the Manufacturing Chain: Implementation and Impact
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Technology - Processing - Page 40

AI-Blox Blox

Processing

Codasip Customisable Codasip L31

GigaDevice Semiconductor GD32F470 Series of High-Performance MCUs

Menta SAS eFPGA SOFT IP

Connect Tech Forge Carrier for NVIDIA® Jetson AGX Orin

BeagleBoard.org Foundation BeagleBone AI-64

Micro Crystal RV-3032-C7

Semtech LoRa Edge™ LR1120

onsemi RSL15 Bluetooth 5.2 Secure Wireless MCU

NXP Debuts New MCX Portfolio of Microcontrollers for the Next Era of Advanced Industrial and IoT Edge Computing

NXP’s MCX Family Addresses All IoT End-Device Development

Imagimob Announces tinyML for Sound Event Detection Applications on Synaptics AI Chip

AIoT Open Platform for Flexible and Scalable Development

Transforming Edge AI with Clusters of Neural Processing Units

IAR Systems Accelerates Innovation for Solutions Based on Arm Cortex-M85 Processor

Microchip Announces First RISC-V-Based System-on-Chip FPGA Enters Mass Production

Agile Analog Receives Its First Chinese Licensee for Its Analog IP

The Problem with the CHIPS Act, Part 2

Embedded Executive: Jeffrey Morroni, Dir. of Power Management R&D for Kilby Labs, Texas Instruments

Synaptics’ FlexSense Sensor Fusion Processor Cuts Board Space and Power

New Module From Grid Connect and RTA Gives Equipment Makers a ‘Universal Translator’ for Industrial Communications

Sponsored

Product of the Week: WOLF Advanced Technology’s NVIDIA Orin-based 3U VPX SBC

u-blox Releases Platform to Test and Validate IoT Solutions

Codasip Adopts Siemens’ OneSpin Tools for Formal Verification

Lattice Introduces Next-Gen Control FPGAs and New Solution Stack for ORAN Deployment

Synopsys Launches the Era of Smarter SoC Design with ML-Driven Big Data Analytics Technology

Modular Touch Computer Design Helps Create The Most Flexible Gas Monitoring System

Imagination Launches Open Access Program, Providing Scale-Ups with a Low-Cost Path to Differentiated Silicon

i.MX 8M Plus Processor from NXP on COM Form Factor efus from F&S Elektronik Systeme

First In-House Designed Core from Ampere, the AmpereOne

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