Introduction to PCIe 6.0

Paul Karazuba

June 1, 2021

Defense in Depth Against Exploits on 11th Gen Intel® Core™ Processors

Insyde Software

May 28, 2021

Firmware is the new frontier for platform security. It is safe to say that if your firmware is compromised, then your platform is compromised. The firmware sets up and maintains the platform’s hardware security capabilities and hands off control to the operating system securely.

Aetina Releases Rugged VPX Board V3T5000-WRC & V3T3000-QRC

Chad Cox

May 27, 2021

BCM Introduces New ECM-3455J Single Board Computer

Chad Cox

May 27, 2021

TQ presents new COM Express Basic Module TQMx110EB with 11th generation Intel Core Processors

Chad Cox

May 27, 2021

PCIe 5.0: Accelerating Data Movement in the Cloud

Matt Jones

May 27, 2021

Ceva Acquires Intrinsix Corp

Chad Cox

May 27, 2021

Renesas Launches LTE CAT-M1 Module For IoT Based On Monarch Technology From Sequans

Tiera Oliver

May 26, 2021

eYs3D Microelectronics Raises $7 Million Series A from Industry Strategic Investors for Vision/AI Chips

Tiera Oliver

May 26, 2021

Viking Enterprise Solutions Introduces New NVMe-over-Fabrics Enterprise Storage Solution

Tiera Oliver

May 24, 2021

Avnet Launches XRF16-Gen 3 System-on-Module for Multi-Channel RF Applications

Tiera Oliver

May 21, 2021

IAR Systems Boosts Development of Embedded Applications Based on NXP’s i.MX RT1160 Crossover MCUs

IAR Systems

May 20, 2021

Sierra Wireless Extends 5G Mobile Broadband with Next Generation 5G Modules

Tiera Oliver

May 19, 2021

SEMIFIVE Collaborates with Arm to Accelerate its Custom SoC Designs

Tiera Oliver

May 19, 2021

Industrial COM Express Type 10 Mini Module with Intel Atom E3900 Processor

WinSystems, Inc.

May 19, 2021

u-blox NINA-B4 Bluetooth 5.1 Module Enables Mesh Networking for IoT Applications

Tiera Oliver

May 18, 2021

Sondrel Reference IP Enables HPC SoCs While Reducing Cost and Design Time by 30 Percent

Brandon Lewis

May 18, 2021

Sondrel has added the SFA 300 reference design to its semi-custom SoC IP portfolio. Consisting of four-CPU clusters featuring 4 TOPS per channel of AI processing and 400 GOPS per channel of DSP performance, clusters can be daisy chained via the PCIe interface to create HPC solutions. The IP reuse solution enables the creation of differentiated AI, 8K video, blockchain, data analytics, and other high-performance data processing solutions by integrating customer-specific IP such that design time and cost can be reduced by up to 30 percent.

SmartDV Automation Tool Suite Accelerates Protocol Debug, Testbench Creation

Brandon Lewis

May 17, 2021

SmartDV has packaged the SmartViP Debug, a tool designed for automated protocol debugging, and SmartTestBench, which automatically generates testbench files and includes a variety of verification scenarios, into a unified automation tool suite. By identifying protocol violations and presenting them in graphical views or through tabular or text-based representations, the combined offering helps eliminate manual verification processes.

Sigasi Studio Offers Free Coding & Syntax Tools for Digital Designers

Brandon Lewis

May 15, 2021

Dante Embedded Platform SDK for SHARC Audio DSPs Benefits AV-over-IP Developers

Brandon Lewis

May 14, 2021

Why the Properties of Graphene at Cryogenic Temperatures are Making Quantum Computing Increasingly Viable

Ellie Galanis

May 12, 2021

ADLINK Releases Industry-First Embedded MXM Graphics Modules on NVIDIA Turing Architecture

Tiera Oliver

May 11, 2021

Armv9 Debug & Trace Support Added to Lauterbach TRACE32 Tool Suite

Brandon Lewis

May 10, 2021

Applied Materials Introduces New Materials to Advance DRAM Technology

Rich Nass

May 10, 2021