Application - Consumer - Page 14

Road to Embedded World: EW North America

Rich Nass

May 26, 2022

Consumer

Bosch Barometric Pressure Sensor Increases Accuracy and Performance in Mobile Devices

Tiera Oliver

June 6, 2022

Infineon and pmdtechnologies Develop 3D Depth Sensing Technology for Magic Leap 2

Taryn Engmark

June 2, 2022

Infineon Introduces New High-Performance XENSIV MEMS Microphones with Audio Capturing for Consumer Electronics

Tiera Oliver

May 31, 2022

Semtech's LoRa Devices Integrated Into REYAX Technology's New Antenna Transceiver Module

Tiera Oliver

May 27, 2022

DevicePilot Launches Core, Shrinking the Cost to Manage Smart Devices at Scale to Pennies or Less

May 26, 2022

embedded world 2022: HY-LINE

HY-LINE

May 23, 2022

embedded world 2022: Rohde & Schwarz

Rohde & Schwarz

May 23, 2022

KDAB at Embedded World 2022 in Nuremberg

KDAB

May 23, 2022

embedded world 2022: Qorvo Solves the IoT's Toughest Tech Challenges

Qorvo, Inc.

May 23, 2022

STMicroelectronics' LD56060: A Low-Noise, Low-Voltage Regulator for Energy-Conscious Applications

Chad Cox

May 19, 2022

Image Provided by Wireless Broadband Alliance

WBA Issues Residential Wi-Fi Sensing Deployment Guidelines for Smart Homes

Chad Cox

May 12, 2022

Rambus to Acquire Hardent

Chad Cox

May 9, 2022

Why Telemedicine IoMT Technology is Trending

John Bailey

May 6, 2022

Balancing Consumer Demands with Regulatory Compliance in Connected Devices

David Wong

May 3, 2022

Littelfuse Pxxx0S3N SIDACtors Provide High Surge Current Overvoltage Protection in Compact Package

Littelfuse

May 3, 2022

TQ Announces Series Maturity of New System-on-Chip Module

TQ-Group

May 3, 2022

Image Courtesy of Microchip Technologies

Microchip Grows its Commitment to the 8-bit PIC and AVR Market

Chad Cox

April 29, 2022

KiCad Hierarchical Sheets for Enhanced Schematics

Jeremy S. Cook

April 28, 2022

Embedded Executive: Duncan Bosworth, GM, Consumer Business Unit, Analog Devices

Rich Nass

April 27, 2022

V-Score Board Separation: Why, How, and Thru-Hole Temporary Connection Trick

Jeremy S. Cook

April 27, 2022

Image Provided by Infineon Technologies AG

Monitor Your Smart Building to Maximize Equipment Life, Lower Costs

Manuel Hollfelder

April 25, 2022

Winbond Proceeds with More DDR3 SDRAM Production

Chad Cox

April 25, 2022

Winbond & Infineon Technologies Collaborate to Double Bandwidth for IoT Applications with HYPERRAM 3.0

Tiera Oliver

April 19, 2022

TouchNetix Announced a New Generation of 3D Touchless User Interfaces

Chad Cox

April 14, 2022

congatec Releases Computer-on-Modules 5G Robots and Material Handling Systems

Chad Cox

April 7, 2022

Image Provided by Toshiba Electronics Europe

Toshiba Releases a New Series of Mikroelektronika Click Boards Featuring Stepper Motor Drivers

Chad Cox

April 5, 2022

High-Performance Toolkit for Deep Learning Inference

Saumitra Jagdale

April 4, 2022

Analog Devices Shrinks Size for Low-Power BioZ Monitoring

Chad Cox

April 4, 2022

NXP Releases Its New Certified EdgeLock Secure Authenticator

Chad Cox

April 1, 2022

Automotive

Advancing Automotive Architectures Through Centralized Storage

December 18, 2024

Winbond Announces Enhanced LPDDR4/4X DRAM Products for Automotive Applications
December 03, 2024
Renesas Announces Automotive Multi-Domain SoC Built with 3-nm Process Technology
November 25, 2024
Shrinking Automotive Power Chips to Advance Automotive AI
November 21, 2024
Embedded Executive: The In-Cabin User Experience, indie Semiconductor
November 13, 2024

Wincomm’s Medical-Grade WMP-27T-PIS Series Recognized for Outstanding Design and Performance

November 18, 2024

Low-Power Tech Transforms Medical Wearables
September 24, 2024
Embedded Executive: The Latest in Medical Wearables, Orca Semi
July 24, 2024
Choosing the Right Partner for Complex Medical-Device Design
June 11, 2024
Wincomm Takes its Medical Solutions to COMPUTEX
May 31, 2024

Embedded Executive: Memory Controllers Are More Complex Than You Think, Silicon Motion

December 18, 2024

Semidynamics' RISC-V Technology Powers UPMEM’s Next-Gen AI Processing-in-Memory Chips
December 09, 2024
New Cryogenic Memory IP from sureCore Enables Quantum Control Electronics Inside Cryostats
November 26, 2024
Embedded Executive: When, Where, and Why Use Rad-Hard Memory, Infineon
November 20, 2024
The Road to electronica: Apacer has the Next-Generation of Industrial Storage
November 06, 2024

Flex Power Modules’ Game-Changing Solutions for AI/ML Data Centers

December 6, 2024

ADATA and Advantech Team Up to Power AI Workloads with Advanced HPC Servers
December 05, 2024
Navitas Combines GaN and SiC Technologies for Industry-Leading 98% Efficient 8.5kW PSU
November 25, 2024
Future-Ready MSI DC-MHS Servers with Dual and Single Intel Xeon 6 Processors for Intensive AI Applications
November 25, 2024
Point2 P1B121 SoC is Transforming AI/ML Datacenters with Ultra-Low Latency and Energy Efficiency
November 19, 2024

Application - Consumer - Page 14

Road to Embedded World: EW North America

Consumer

Bosch Barometric Pressure Sensor Increases Accuracy and Performance in Mobile Devices

Infineon and pmdtechnologies Develop 3D Depth Sensing Technology for Magic Leap 2

Infineon Introduces New High-Performance XENSIV MEMS Microphones with Audio Capturing for Consumer Electronics

Semtech's LoRa Devices Integrated Into REYAX Technology's New Antenna Transceiver Module

DevicePilot Launches Core, Shrinking the Cost to Manage Smart Devices at Scale to Pennies or Less

embedded world 2022: HY-LINE

embedded world 2022: Rohde & Schwarz

KDAB at Embedded World 2022 in Nuremberg

embedded world 2022: Qorvo Solves the IoT's Toughest Tech Challenges

STMicroelectronics' LD56060: A Low-Noise, Low-Voltage Regulator for Energy-Conscious Applications

WBA Issues Residential Wi-Fi Sensing Deployment Guidelines for Smart Homes

Rambus to Acquire Hardent

Why Telemedicine IoMT Technology is Trending

Balancing Consumer Demands with Regulatory Compliance in Connected Devices

Littelfuse Pxxx0S3N SIDACtors Provide High Surge Current Overvoltage Protection in Compact Package

TQ Announces Series Maturity of New System-on-Chip Module

Microchip Grows its Commitment to the 8-bit PIC and AVR Market

KiCad Hierarchical Sheets for Enhanced Schematics

Embedded Executive: Duncan Bosworth, GM, Consumer Business Unit, Analog Devices

V-Score Board Separation: Why, How, and Thru-Hole Temporary Connection Trick

Sponsored

Monitor Your Smart Building to Maximize Equipment Life, Lower Costs

Winbond Proceeds with More DDR3 SDRAM Production

Winbond & Infineon Technologies Collaborate to Double Bandwidth for IoT Applications with HYPERRAM 3.0

TouchNetix Announced a New Generation of 3D Touchless User Interfaces

congatec Releases Computer-on-Modules 5G Robots and Material Handling Systems

Toshiba Releases a New Series of Mikroelektronika Click Boards Featuring Stepper Motor Drivers

High-Performance Toolkit for Deep Learning Inference

Analog Devices Shrinks Size for Low-Power BioZ Monitoring

NXP Releases Its New Certified EdgeLock Secure Authenticator

Trending Articles

Embedded Software Engineering Trends

sureCore Partners with Sarcina to Innovate Cryogenic IP Design

Chipping In: Europe’s Role in the Semiconductor Industry

IBASE IB996 CPU Card Combines Intel Core Power with Extensive I/O and Display Options

From Atari to Bosch: Apertis 2024 Expands Embedded Device Capabilities

Automotive

Advancing Automotive Architectures Through Centralized Storage

Healthcare

Wincomm’s Medical-Grade WMP-27T-PIS Series Recognized for Outstanding Design and Performance

Storage

Embedded Executive: Memory Controllers Are More Complex Than You Think, Silicon Motion

HPC/Datacenters

Flex Power Modules’ Game-Changing Solutions for AI/ML Data Centers